Thomas Hulin joined the Institute of Robotics and Mechatronics at the German Aerospace Center (DLR) in 2003 as a research associate. Since 2020, he heads the Telemanipulation Research Group. His research interests include haptic teleoperation (control, devices, and algorithms), physical human-robot interaction, robot visualization, augmented reality, and skill transfer. He is co-author of more than 60 peer-reviewed scientific articles in international journals, books and conferences. He was granted 9 patents and is co-inventor of the robotic systems HUG and SwarmRail, and of the interaction devices CoaxHaptics, VibroTac S, and FingerTac. He has served as an Associate Editor for IEEE since 2019 (IEEE ICRA 2020 and 2021, IEEE WHC 2021, RA-L since 2021).
Projects/Cooperation within CeTI you are involved in:
I am involved in two main cooperative activities, (i) researching haptic codecs and control approaches for teleoperation over the internet, and (ii) creating a haptic data glove that combines sensory technology with tactile augmented feedback.
CeTI rooms within CeTI you are involved in:
What do you value most about your work at CeTI?
In CeTI, I enjoy the great collaboration with excellent scientists and the stimulating conversations and meetings. CeTI offers an inspiring work environment and enough freedom to realize my own ideas.
What was your best moment at CeTI so far?
The best CeTI moment was when I was able to experience augmented haptic feedback for the first time: Our tactile device FingerTac changed the perception with the real world, in a way that the touch of the keys on the keyboard was altered. I wish everyone interested could experience augmented haptic feedback soon.
What else would you like to research?
I would like to make haptic teleoperation tangible for everyone. For this purpose, I want to research new haptic control approaches, haptic devices, haptic algorithms, and teleoperation concepts.
How do you spend your spare time?
In my spare time, I teach my kids the important skills for little robotic engineers that often fall short in school, e.g. programming, mechanical design and 3d printing.