Curriculum Vitae
Xin Xu is Group Leader for IC Design of High-Frequency Amplifiers at the Chair of Circuit Design and Network Theory (PSN) at TU Dresden and serves as CeTI F3 Coordinator. He received his Bachelor’s degree in Microelectronics from Xidian University, China, and his Diplom degree from TU Dresden, both with distinction. He completed his PhD at TU Dresden with summa cum laude, focusing on millimeter-wave integrated circuits in advanced CMOS technologies.
His research focuses on high-speed and millimeter-wave integrated circuits for next-generation communication and sensing systems. He designs power amplifiers, low-noise amplifiers, mixers, phase shifters, and fully integrated front-ends in 22 nm FD-SOI CMOS and SiGe BiCMOS technologies, with particular emphasis on energy-efficient architectures for joint communication and sensing at 60 GHz and beyond.
Within CeTI, he contributes to the development of low-power mm-wave front-ends enabling real-time, high-bandwidth interaction systems. His work has been published in leading IEEE journals and conferences and has received several Best Student Paper Awards.
Projects/Cooperation within CeTI you are involved in:
• Cooperations between rooms among F3, F2, C2
What are the main topics or questions that drive your research?
My research focuses on millimeter-wave integrated circuits for next-generation high-speed communication and sensing systems.
What inspired you to pursue your current field of work ?
I was inspired by the continuously growing demand for higher speed and bandwidth in modern communication technologies.
What excites you most about being part of CeTI?
What excites me most about being part of CeTI is the diversity of research fields and the flexibility to collaborate across disciplines.
Which challenge or question has recently sparked your curiosity?
As I am still new to CeTI, I am curious about exploring the wide range of interdisciplinary research topics within the cluster.
How do you like to recharge or spend your time outside of work?
I like to recharge by spending time outdoors in nature.
Publications
| 1. | An investigation of the low-power capability of SiGe HBTs in V-band LNA design (Proceedings Article) In: Proceedings of the Asia-Pacific Microwave Conference (APMC), 2025. |
| 2. | A 60 GHz cross-coupled transformer-based quadrature-phase coupler in 22 nm FD-SOI (Proceedings Article) In: Proceedings of the European Microwave Integrated Circuits Conference (EuMIC), 2024. |
| 3. | A 60 GHz broadband LNA with joined variable gain control and switching in 22 nm FD-SOI (Journal Article) In: IEEE Access, vol. 12, pp. 111627–111637, 2024. |
| 4. | A 60 GHz down-conversion mixer featuring energy-saving standby-mode in 22 nm FD-SOI (Proceedings Article) In: Proceedings of the Asia-Pacific Microwave Conference (APMC), 2023. |
| 5. | A dual-band vector-sum phase shifter using I-Q phase compensation technique for 5G applications (Proceedings Article) In: Proceedings of the European Microwave Integrated Circuits Conference (EuMIC), 2023. |
| 6. | A 60 GHz up-conversion mixer in 22 nm FD-SOI CMOS with back-gate mode switching (Proceedings Article) In: Proceedings of the IEEE International Symposium on Radio-Frequency Integration Technology (RFIT), 2023, (Best Student Paper Award). |
| 7. | A 28 GHz and 38 GHz dual-band up-conversion mixer for 5G applications in 22 nm FD-SOI CMOS (Proceedings Article) In: Proceedings of the Conference on PhD Research in Microelectronics and Electronics (PRIME), 2023. |
| 8. | Two Wilkinson-power-combiners designed with transmission lines and lumped elements in 22 nm FD-SOI CMOS (Proceedings Article) In: Proceedings of the IEEE Radio and Antenna Days of the Indian Ocean International Conference (RADIO), 2023, (Best Student Paper Award). |
| 9. | A 62 GHz high-efficiency power amplifier with modulation capability via back-gate in 22 nm FD-SOI (Journal Article) In: IEEE Solid-State Circuits Letters, vol. 6, pp. 49–52, 2023. |
| 10. | 37.2-to-42.0 GHz VCO with -93.4 dBc/Hz phase noise for FMCW radar in 22 nm FDSOI (Proceedings Article) In: Proceedings of the European Microwave Integrated Circuits Conference (EuMIC), 2022. |
