PhD Researcher

Phone: +49 152 57535128

Ran Yin

Ran Yin, graduated from Nankai University as bachelor and studied Nano Electronic System in TU Dresden from 2018 to 2021, where she did investigation of Cu-nanowire based fine-pitch interconnect technology as her master thesis. Currently, she joined the research group at CeTI. The group’s research focus is on ultra-thin flexible electronic circuits for interconnecting and processing data collected by sensors on the human body; Integrating these with flexible and stretchable substrates for a natural interface. Her goal is to enable the advanced packaging of chips on the flexible and stretchable substrate.

CeTI rooms within CeTI you are involved in:

Further Questions:

What do you value most about your work at CeTI?

Packaging of flexible and stretchable Electronics is a very potential topic. As I started freshly this month, I got warm welcome and a lot of support! The working environment is very inspiring and motivating. I enjoy working among the excellent scientists here.

What was your best moment at CeTI so far?

The first meeting we had together as a group, when I talked about my idea as a new member, I was carefully listened to and I got positive feedbacks. It was impressive. I am sure there will be more and more sparkling moments in the future!

What else would you like to research?

The state of art interconnects technology applied on stretchable electronics. It would be interesting if there is a way to utilize the nanowire properties on the flexible electronic packaging.

How do you spend your spare time?

I love to do sports and play all kinds of board games. Currently I am also trying to improve my German in my free time.


Ran Yin; Krzysztof Nieweglowski; Karsten Meier; Karlheinz Bock

Embedding of thinned RF chips and electrical redistribution layer characterization (Proceedings Article)

In: Proceedings of the IEEE Electronics Packaging Technology Conference (EPTC), 2022.

(Links | BibTeX)


Ran Yin; Krzysztof Nieweglowski; Karsten Meier; Karlheinz Bock

Characterization of material adhesion in redistribution multilayer for embedded high-frequency packages (Proceedings Article)

In: Proceedings of the IEEE Electronics System-Integration Technology Conferences (ESTC), 2022.

(Links | BibTeX)


Ran Yin; Clara Pechnig; Krzysztof Nieweglowski; Karsten Meier; Karlheinz Bock

Process developments on sheet molding and redistribution deposition for Cu-pillar chips (Proceedings Article)

In: Proceedings of the International Spring Seminar on Electronics Technology (ISSE), 2022, (Excellent Paper Award for Young Scientist).

(Links | BibTeX)